Skip to main content

2D FET from polymorphic material molbdenum telluride


In simple terms, FETs can be thought as high-speed switches, composed of two metal electrodes and a semiconducting channel in between. Electrons (or holes) move from the source electrode to the drain electrode, flowing through the channel. While 3D FETs have been scaled down to nanoscale dimensions successfully, their physical limitations are starting to emerge. Short semiconductor channel lengths lead to a decrease in performance: some electrons (or holes) are able to flow between the electrodes even when they should not, causing heat and efficiency reduction. To overcome this performance degradation, transistor channels have to be made with nanometer-scale thin materials. However, even thin 3D materials are not good enough, as unpaired electrons, part of the so-called "dangling bonds" at the surface interfere with the flowing electrons, leading to scattering.
Passing from thin 3D FETs to 2D FETs can overcome these problems and bring in new attractive properties. "FETs made from 2D semiconductors are free from short-channel effects because all electrons are confined in naturally atomically thin channels, free of dangling bonds at the surface," explains Ji Ho Sung, first author of the study. Moreover, single- and few-layer form of layered 2D materials have a wide range of electrical and tunable optical properties, atomic-scale thickness, mechanical flexibility and large bandgaps (1~2 eV).
The major issue for 2D FET transistors is the existence of a large contact resistance at the interface between the 2D semiconductor and any bulk metal. To address this, the team devised a new technique to produce 2D transistors with semiconductor and metal made of the same chemical compound, molybdenum telluride (MoTe2). It is a polymorphic material, meaning that it can be used both as metal and as semiconductor. Contact resistance at the interface between the semiconductor and metallic MoTe2 is shown to be very low. Barrier height was lowered by a factor of 7, from 150meV to 22meV.
IBS scientists used the chemical vapor deposition (CVD) technique to build high quality metallic or semiconducting MoTe2 crystals. The polymorphism is controlled by the temperature inside a hot-walled quartz-tube furnace filled with NaCl vapor: 710°C to obtain metal and 670°C for a semiconductor.
The scientists also manufactured larger scale structures using stripes of tungsten diselenide (WSe2) alternated with tungsten ditelluride (WTe2). They first created a thin layer of semiconducting WSe2 with chemical vapor deposition, then scraped out some stripes and grew metallic WTe2 on its place.
It is anticipated that in the future, it would be possible to realize an even smaller contact resistance, reaching the theoretical quantum limit, which is regarded as a major issue in the study of 2D materials, including graphene and other transition metal dichalcogenide materials.


Journal Reference
Ji Ho Sung, Hoseok Heo, Saerom Si, Yong Hyeon Kim, Hyeong Rae Noh, Kyung Song, Juho Kim, Chang-Soo Lee, Seung-Young Seo, Dong-Hwi Kim, Hyoung Kug Kim, Han Woong Yeom, Tae-Hwan Kim, Si-Young Choi, Jun Sung Kim, Moon-Ho Jo. Coplanar semiconductor–metal circuitry defined on few-layer MoTe2 via polymorphic heteroepitaxyNature Nanotechnology, 2017; DOI: 10.1038/NNANO.2017.161

Comments

Popular posts from this blog

Intel's upcoming 10-nanometer chip manufacturing technology

At long last, chip giant  Intel  (NASDAQ: INTC) opened up about its upcoming 10-nanometer chip manufacturing technology, at its first-ever Technology and Manufacturing Day. The company has -- frustratingly -- kept key details of this technology under wraps for years now, but Intel is now putting them out there for all to see.  Without further ado, let's look at what Intel had to tell us about this new tech. A large jump in density Let's talk performance Competitive comparison and no yield information Image source: Intel. Chipmakers generally like to reduce the area of its transistors with major new technology shifts. This area reduction is important in reducing transistor costs on a yield-normalized basis, a really important factor for product cost. Chipmakers are ultimately able to cram more features and functionality into a chip while maintaining reasonable cost structures. Intel says that in moving from 14 nanometers to 10, it's delivering an incre...

Linking hydrogen atom to silicon surface: A new way for greener, smaller and faster electronics

A key step in unlocking the potential for greener, faster, smaller electronic circuitry was taken recently by a group of researchers led by UAlberta physicist Robert Wolkow. The research team found a way to delete and replace out-of-place atoms that had been preventing new revolutionary circuitry designs from working. This unleashes a new kind of silicon chips for used in common electronic products, such as our phones and computers. "For the first time, we can unleash the powerful properties inherent to the atomic scale," explained Wolkow, noting that printing errors on silicon chips are inevitable when working at the atomic scale. "We were making things that were close to perfect but not quite there. Now that we have the ability to make corrections, we can ensure perfect patterns, and that makes the circuits work. It is this new ability to edit at the atom scale that makes all the difference." Think of a typing mistake and the ability to go back and white ...

Nanoimprinting accelerating the fabrication of nano-optical devices

Combining speed with incredible precision, a team of researchers has developed a way to print a nanoscale imaging probe onto the tip of a glass fiber as thin as a human hair, accelerating the production of the promising new device from several per month to several per day. The high-throughput fabrication technique opens the door for the widespread adoption of this and other nano-optical structures, which squeeze and manipulate light in ways that are unachievable by conventional optics. Nano-optics have the potential to be used for imaging, sensing, and spectroscopy, and could help scientists improve solar cells, design better drugs, and make faster semiconductors. A big obstacle to the technology's commercial use, however, is its time-consuming production process. The new fabrication method, called fiber nanoimprinting, could unplug this bottleneck. It was developed by scientists at the Molecular Foundry, located at the Department of Energy's Lawrence Berkeley Nat...